Latest News and Insights on the Semiconductor Industry: IGBT Supply-Demand Balance, TSMC Revenue, Samsung Electronics Loss, South Korea's Production Drop, and Kioxia-Western Digital Flash Memory

1. IGBT Supply-Demand Balance Expected in Q3 2023

According to DIGITIMES Asia survey quoted by Science and Technology Board Daily, power semiconductor devices are still in high demand despite the alleviation of the shortage of automotive ICs. Analysts predict that IGBTs may reach a supply-demand balance in Q3 2023.

2. TSMC Revenue Expected to Decline in Q2 2023

Taiwan’s Electronic Times, cited by Science and Technology Board Daily, reports that TSMC’s major customers, including MediaTek, Apple, and Nvidia, have cut orders in Q2 2023, causing a drop in revenue. TSMC’s 16/12nm capacity utilization rate has fallen from 80% in Q1 to 50% in Q2. Despite the launch of new iPhones and a 6% increase in OEM quotations, other major customers are becoming more conservative, and the annual revenue growth goal is challenging.

3. Samsung Electronics Chip Business Expected to Lose 3.3 Trillion Won in Q1 2023

Foreign media reports cited by TechWeb indicate that Samsung Electronics’ memory chip business is facing performance pressure due to declining demand for consumer electronics products, resulting in a predicted loss of 3.3 trillion won in Q1 2023, approximately 2.5 billion US dollars. Analysts expect shipments of DRAM and NAND flash memory to decline by 13% and 12%, respectively, in Q1 2023.

4. South Korea’s Semiconductor Production Drops 17.1% MoM in February 2023

IT House reports that data from the Korean Statistical Office shows a 17.1% month-on-month decline in South Korea’s semiconductor production in February 2023, the largest drop in over 14 years. The reduction in global demand for chips has weakened the output of memory chips and system semiconductors, leading to difficulties for South Korea’s economy.

5. Kioxia and Western Digital Announce Technical Details of 218-Layer NAND Flash Memory

According to Fast Technology, Kioxia and Western Digital have jointly developed the next-generation 3D NAND flash memory stacked to 218 layers, with a storage density over 50% higher than the previous generation, reaching 1Tb. They have also developed a new CBA technology that improves storage density and I/O speed by bonding CMOS wafers and cell array wafers together. This technology is similar to the YMTC Xtacing 3.0 technology.

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