Description: Uncapping (unsealing) mainly uses instruments to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer’s logo, the year of copyright, and the wafer code, which can determine the authenticity of the chip.

Scope of application: verification of chip authenticity and failure analysis, etc.

Open cover test picture:

Picture of the test equipment with the cover open:

Introduction to Open Cover Test


The decap test, also known as DECAP, is a destructive experiment. It uses chemical reagents or laser etching to remove the external packaging shell of the component to check the original factory logo, layout, process defects, etc. on the surface of the grain. Testing is an auxiliary testing method.


Uncap (unseal) range


Ordinary package COB, BGA, QFP, QFN, SOT, TO, DIP, BGA, COB ceramic, metal and other special packages. General chemical (Chemical) unsealing, mechanical (Mechanical) unsealing, laser (Laser) unsealing, PlasmaDecap


Decap lab can handle almost all IC packaging forms (COB.QFP.DIPSOT, etc.), bonding type (AuCuAg).


Precautions for opening (unsealing)


All operations should be performed in a fume hood, and acid-resistant gloves should be worn.


The more the product is opened, the less acid it will drop to the end, and it should be cleaned frequently to avoid over-corrosion.


During the cleaning process, be careful not to touch the surface of the gold wire and the chip with the tweezers, so as not to scratch the chip and the gold wire.


According to product or analysis requirements, the conductive glue or the second point under the chip should be exposed after opening the cap.


In addition, in some cases, the uncapped products should be retested in rows. At this time, it should be placed under an 80 times microscope to observe whether the gold wire on the chip is broken or tattered. If there is no wire, use a blade to scrape off the black film on the pin and send it for testing.


Be careful not to control the cap opening temperature too high.