QUALITY CONTROL

Solderability Testing Concept

During the assembly and welding process of electronic products, poor selection of solderable terminals or solder paste for circuit boards and components will cause welding problems and directly affect the quality of products. The main welding problems include poor wetting, bridging, cracks, etc., which will increase the workload of quality control and generate a lot of maintenance, resulting in waste of manpower and financial resources, such as false welding, virtual welding and poor welding strength, etc., will directly lead to reliable sexual issues. Solderability test quantitatively evaluates the solderability of the tested samples by testing the solderability of the incoming materials, and directly provides guidance on whether the incoming materials can be put into production or can be put into production after adjustment of the process window. For incoming batches of components, due to the small output and long storage time, the solderability test is more meaningful, and the solderability evaluation can be performed on the components before use to determine whether the use of this batch of components will Lead to the occurrence of welding quality problems.

Principles of Solderability Testing

The solderability test is to determine the quality of the sample by selecting the sample, simulating the welding process, and according to the test results. In the electronics industry, solderability testing is carried out by measuring the quality of solder paste and flux used, the quality of the soldering process, etc., when evaluating the influence of mounted samples. The wetting balance (or wetting balance) test method uses a sensor to detect a small force level, combined with time to determine the strength of tin and rapid wetting. The specific sample is placed on the fixture, and the sample is immersed in the solder at a specified temperature. The force and time data are transmitted to the host computer through the sensor, and the curve and data file are formed through the software to evaluate the soldering quality accurately and quantitatively.

Purpose and significance of solderability test

Solderability testing is generally used to make a qualitative and quantitative evaluation of the solderability of components, printed circuit boards, solder and flux, etc. In the assembly welding process of electronic products, the welding quality directly affects the quality of the whole machine. Therefore, in order to improve the welding quality, in addition to strictly controlling the process parameters, it is also necessary to conduct scientific solderability tests on printed circuit boards and electronic components.

Through the implementation of solderability test, it helps enterprises to determine whether the solderability after production assembly is good or not and the quality of products is good or bad. In practical operation, micro-spectrum technology has further enriched the technical means of solderability testing of components such as printed circuit boards, clarified the internal factors affecting solderability, and helped technical engineers in the manufacturing industry to improve product quality and achieve zero defects. The welding process has given a great help.

Development Trend of Solderability Test Technology

Solderability testing is generally used to make a qualitative and quantitative evaluation of the solderability of components, printed circuit boards, solder and flux, etc. In the assembly and welding process of electronic products, the welding quality directly affects the reliability and quality of the whole system.

Through the implementation of solderability test, it helps enterprises to determine whether the solderability after production assembly is good or not and the quality of products is good or bad. Microspectrum technology has further enriched the solderability testing techniques for components such as printed circuit boards in practice, clarified the internal factors affecting solderability, and improved product quality and zero-defect welding for technical engineers in the manufacturing industry. Craftsmanship helped tremendously.

Major international standard organizations (IEC, IPC, DIN, JIS, etc.) have recommended various methods, such as “J-STD-002B2003-2 Solderability Test of Components, Lugs, and Terminals” “J-STD-003B (2007 -3) Printed Circuit Board Solderability Test”, “IPC-TM-6502.4.1 Metal Surface Solderability”, “GB/T4677 Printed Board Test Method”, “IEC60068-2-58/IEC60068-2-20 Solderability And thermal stress test” and other standards can carry out different types of solderability tests, but regardless of the repeatability of the test and the ease of interpretation of the results, the wetting balance method (Wetting Balance) is currently recognized as a reliable method for qualitative and quantitative analysis. Solderability test method.

By soaking the sample into the solder, the simulated welding process is transmitted to the image recorder, and the solderability curve is formed on the computer. The wetting balance method is to place the sample in a special fixture and immerse it in the solder paste at a set temperature. During this period, the data is transmitted to the computer through the force sensor, and the curve and data files are generated through the software to accurately and quantitatively evaluate the welding quality. This test method requires a large amount of equipment investment and has certain requirements for the test environment, and the test results are accurate and convincing.