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X-RAY TEST

Description: X-ray test is a real-time non-destructive analysis to check the hardware components inside the component, mainly check the lead frame of the chip, wafer size, gold wire bonding diagram, ESD damage and holes, customers can provide good products for comparison examine.


Scope of application: metal materials and parts, plastic materials and parts, electronic components, electronic components, LED components, etc. Internal crack detection, foreign body defect detection, analysis of internal displacement of BGA, circuit boards, etc.; identification of empty soldering, virtual soldering Analysis of BGA soldering defects, etc.

 

X-Ray inspection image:

X-Ray inspection equipment picture:

Introduction to X-Ray inspection:

 

The X-ray (X-ray) detector uses low-energy X-rays to quickly detect the inspected object without damaging the inspected object. Use high voltage to strike the target to generate X-ray penetration to detect the internal structure quality of electronic components, semiconductor packaging products, and the welding quality of various types of SMT solder joints.

 

X-Ray detection content:

 

1) Defect inspection in IC packaging, such as: layer peeling, burst, void and integrity inspection of bonding wires;

 

2) Defects that may occur during the printed circuit board process, such as: poor alignment or bridging and open circuits;

 

3) SMT solder joint void detection and measurement;

 

4) Defect inspection of open circuit, short circuit or abnormal connection that may occur in various connection lines;

 

5) Integrity inspection of solder balls in solder ball array packaging and chip-on-chip packaging;

 

6) Cracking of plastic materials with high density or void inspection of metal materials;

 

7) Chip size measurement, wire bonding arc measurement, component solder area ratio measurement.

 

X-Ray detection steps:

 

Confirm the test position and requirements of the sample type/material→Put the sample into the inspection table of the X-Ray perspective instrument for X-Ray perspective inspection→judgment and analysis of the picture→mark the defect type and position.

 

X-Ray inspection items:

 

1. Packaging process inspection of integrated circuits: layer peeling, cracking, voids and wire bonding process;

 

2. Printed circuit board manufacturing process inspection: welding line offset, bridging, open circuit;

 

3. Solderability inspection of surface mount technology: inspection and measurement of solder joint voids;

 

4. Connection line inspection: open circuit, short circuit, abnormal or bad connection defects;

 

5. Integrity inspection of solder balls in solder ball array packaging and chip-on-chip packaging;

 

6. High-density plastic material cracking or metal material inspection;

 

7. Chip size measurement, wire bonding arc measurement, component solder area ratio measurement.